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Texas Instruments Evaluation Board Electronics

TI Launchpad with DRV8305 Booster Packs Launchpad F28069M with two DRV8305 Booster Packs - weight: 85g

Description

The TI evaluation boards provide a ready-to-use solution for dual brushless motor control, combining the Launchpad F28069M microcontroller with DRV8305 Booster Pack motor drivers.

Key Specifications

  • Microcontroller: TI Launchpad F28069M
  • Motor drivers: 2x DRV8305 Booster Packs
  • Channels: 2 independent brushless motors
  • Continuous current: 15A per channel
  • Peak current: 20A per channel
  • Supply voltage: 5V - 45V (typically 24V)
  • Control frequency: 10kHz Field Oriented Control (FOC) per channel
  • Main loop: 1kHz control loop with realtime PC
  • Communication: CAN or USB
  • Weight: 85g

Components

ComponentDetailsOrdering Information
TI Launchpad F28069MProduct PageMouser 595-LAUNCHXL-F28069M
DigiKey 296-38832-ND
TI Booster Pack DRV8305EVMProduct PageMouser 595-STXL-DRV8305EVM
DigiKey 296-43181-ND

Documentation

Brushless Motor Control System

Brushless motor control system overview The system consists of:
  1. Power supply (24V)
  2. TI Launchpad with motor driver boards
  3. Brushless motors with encoders
  4. Communication interface (CAN or USB)

Field Oriented Control (FOC)

Field Oriented Control diagram The TI boards implement Field Oriented Control for efficient, high-performance motor control. FOC provides:
  • Precise torque control
  • Smooth operation at all speeds
  • High efficiency
  • Reduced acoustic noise
Learn more: Teaching Old Motors New Tricks - TI Seminar

Launchpad Pin Assignment

Launchpad pin assignment

GPIO Pins

  • Status LEDs connected to digital GPIO pins
  • GPIO 26 to ground disables motor drivers

Analog Inputs

The Launchpad has 16 analog input channels: Per Booster Pack (7 channels each):
  • 3 phase voltages
  • 3 phase currents
  • 1 supply voltage
Available channels: ADCIN A6 and ADCIN B6
Caution: Do not connect 5V sources to analog input channels. Maximum voltage is 3.3V.

Booster Pack Positions

Booster pack positions The two booster packs are installed on the bottom side of the Launchpad, providing dual motor control.

Board Preparation

Setting the Jumpers

1

Initial State

Initial jumper configurationTI Launchpad with jumper settings as delivered.
2

Remove Jumpers

Remove jumpersRemove the jumpers JP1, JP2, JP4, and JP5.
Critical: Ensure JP1 and JP2 are removed when connecting the Launchpad to USB and external power supply. This insulates your computer from external power supplied through the booster packs.
3

Install JP6

Install JP6Install jumper JP6. Verify that JP7 and JP3 are also connected.

Encoder Connector Installation

1

Prepare Components

Prepare encoder wiresGather encoder wires (0.14 mm² Kabeltronik) and 5-pole Hirose DF13 connectors.
2

Solder Connector

Solder wires to connectorSolder wires to the Hirose connector following the pin assignment.Pin assignment
3

Apply Heat Shrink

Heat shrink on wiresApply thin heat shrink to red and yellow wires.Larger heat shrinkApply larger heat shrink around all wires.
4

Prepare Second Cable

Second cableRepeat for the second encoder cable.
5

Locate Encoder Pins

Encoder pinsFind the encoder pins on the Launchpad. The two ports are labeled QEP_A and QEP_B.
6

Bend Pins

Bend pinsUse flat pliers to bend the pins down by 90 degrees.
7

Solder and Finish

Solder encoder wiresSolder the encoder wires and apply heat shrink.Launchpad pin assignmentCompleted LaunchpadThe Launchpad is now prepared.

Booster Pack Preparation

Modifying Screw Terminals

This modification is optional but recommended for cleaner wire routing. Both booster packs must be connected to the power supply.
1

Initial State

Screw terminalsBooster pack screw terminals to be modified.
2

Loosen Screws

Loosen screwsLoosen screws on the screw terminal as much as possible.
3

Bend Metal Clips

Bend clipsUse a small screwdriver to bend the metal clips outwards.All clips bentRepeat for all 5 metal clips.
4

Remove Screws

Remove screwsPush on the screws from the bottom and remove them. Keep screws for reinstallation.Remove metal clipsRemove the metal clips.
5

Modify Covers

Mark holesMark hole locations on the two-pin power terminal with a pen.Remove coversPush plastic covers inwards to remove them.Removed coversDrill holesDrill the plastic cover at marked locations. Start with 2mm, then 2.5mm, then 3mm drill bit.
6

Reinstall Covers

Reinstall coversReinstall plastic covers. The 2-pin power terminal cover installs normally. Rotate the 3-pin cover 180 degrees.Bottom booster packOn the bottom booster pack, only modify the 3-pin phase terminal. Leave the 2-pin power terminal unchanged.

Power Supply Wire Preparation

1

Strip Insulation

Cut insulationUse 1mm² wire. Carefully cut into the insulation with a cutter and rotate.Cut with offsetCut the insulation again with a 5mm offset.
2

Remove Insulation

Remove insulationCarefully cut and remove the separated insulation.
3

Twist and Solder

Twist and solderTwist the wire and apply solder.Ground wireRepeat for the power supply ground wire.
4

Shorten and Connect

Shorten wiresShorten wires to about 7cm, remove 5mm insulation, and apply solder.Determine wire lengthPlace booster packs on Launchpad to determine wire length.Install connectorsInstall 4mm connectors for power supply.

Motor Phase Wire Preparation

1

Prepare Wires

Motor phase wiresPrepare six motor phase wires using 0.5mm² wire and 2mm connectors.
2

Solder and Label

Solder and labelSolder connectors, apply heat shrink, and label motor phases.
3

Install Wires

Install wiresInstall power wire and motor phase wires on booster packs.

Final Assembly

Install booster packs Install the two booster packs on the bottom of the Launchpad. Ensure pin headers are aligned correctly. Completed assembly The TI dual motor driver electronics are now ready for use with actuator modules.

DIP Switch Configuration

DIP switch settings

Switch Settings

Setting: ON - ON - OFFUse this setting for normal operation when motor control code is programmed into flash memory.

CAN Communication

Dual channel CAN card CAN connector

Setup

  1. Install a dual channel CAN card in your computer (e.g., PEAK PCI Express)
  2. Connect using a 9-pin D-sub connector
  3. Flash the Launchpad via USB with DIP switch: ON - ON - ON
  4. Set DIP switches to ON - ON - OFF (run from flash)
  5. Control motors via CAN at 1kHz
See Wiring for detailed CAN connector wiring information.

Compatible Robots

The TI Evaluation Boards are used for:
  • TriFingerEDU v1
  • Quadruped Robot 8dof v1
  • Leg Test Stand v1

Comparison with Micro Driver

Size comparison The Micro Driver Electronics provides the same capabilities as the TI boards with these differences:
FeatureTI BoardsMicro Driver
SizeLarge10x smaller
Weight85g13g (6x lighter)
ProgrammingOnboard USBExternal JTAG
CommunicationCAN/USBSPI (Master Board)
CostLower (evaluation pricing)Higher (production)
See Micro Driver for more information.

Resources

Authors

Felix Grimminger

License

BSD 3-Clause License Copyright (c) 2019-2021, Max Planck Gesellschaft and New York University

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